Magic Ray AOI
Magic Ray AOI visual inspection systems
Magic Ray is a company specialized in the development of automated visual inspection systems for the electronics industry, with a strong presence in Asian markets and an expanding footprint across Europe and America.
Magic Ray’s core products are AOI (Automated Optical Inspection) systems, which combine advanced optical technologies with powerful software algorithms to perform fully automated visual inspection of electronic assemblies and components.
Its comprehensive product portfolio and advanced technologies make these solutions highly flexible, positioning Magic Ray among the leading global providers of 2D and 3D inspection systems.
Magic Ray AOI systems are used across a wide range of applications, including printed circuit board assembly (PCBA), semiconductor packaging, and Mini LED display manufacturing. They support industries such as computing, telecommunications, automotive, consumer electronics, home appliances, industrial automation, medical, aerospace, and defense.
Through high-speed, high-accuracy visual inspection solutions, Magic Ray helps manufacturers achieve reliable, efficient, and optimized production processes in advanced industrial automation environments.
Key inspection capabilities include:
- Simultaneous top and bottom post-reflow inspection
- Pre-wave inspection
- Pre-reflow inspection
These functions provide a robust and reliable inspection platform capable of meeting the demanding requirements of modern electronics manufacturing.
Main Features
Granite Platform – The granite structure ensures exceptional system stability and mechanical accuracy, maintaining consistent positioning performance and enabling easy program migration between different machines.
Industrial Camera + Telecentric Lens – The use of a telecentric lens enables accurate inspection of tall components while eliminating shadowing effects in surrounding areas, ensuring reliable defect detection.
Pad Position Recognition – The system can automatically identify pad positions, optimizing inspection accuracy even on PCBs affected by deformation during the reflow process.
IPC Standards-Based Position Analysis Parameters – Position analysis is performed according to IPC standards, ensuring more accurate and reliable inspection results.
IPC-A-610 Class 3 Component Offset Detection – If a component is displaced beyond the pad by more than 25% of the electrode dimension, the inspection result is classified as NG (No Good).
Magic Ray AOI systems combine precision optics, intelligent software algorithms, and advanced inspection capabilities to deliver reliable quality control throughout the entire PCB assembly process.
Spostamento IPC-A-610-D Class 3
Se il componente è spostato fuori dal pad più del 25% della dimensione dell’elettrodo, il test sarà NG (NoGood).
