Magic Ray 3D SPI optical inspection
The Magic-Ray 3D SPI Icon is an advanced 3D Solder Paste Inspection (SPI) system designed to deliver exceptional accuracy and reliability throughout PCB manufacturing and electronics assembly processes.
High-Precision 3D Inspection
The innovative Zero Reference on Pad technology performs measurements directly on each individual pad, ensuring highly accurate inspection results even when PCB warpage or deformation is present.
Outstanding Inspection Performance
By combining advanced 3D measurement algorithms with true color imaging, the system accurately detects solder bridges, insufficient or excessive solder, solder splashes (“icicles”), contamination, and other printing defects, improving process control and inspection reliability.
High-Speed Operation
Multiple optical configurations combined with a 12 MP high-resolution camera provide fast inspection speeds while maintaining exceptional measurement accuracy, maximizing productivity on high-volume SMT production line
Superior Resistance to Color Variations
The system automatically adjusts inspection parameters to accurately inspect both black and white PCBs, ensuring consistent measurement performance regardless of board color or surface finish.
Fast Program Generation
Inspection programs can be created quickly, with or without Gerber data, reducing setup time and simplifying the introduction of new PCB assemblies into production.
Process Optimization
Integrated Statistical Process Control (SPC) analysis provides valuable production data that helps optimize solder paste printing, improve process stability, and enhance overall manufacturing quality.
Advanced SPC Analysis
The intuitive SPC interface delivers comprehensive statistical information, enabling continuous process improvement and supporting data-driven quality management.
Real-Time Quality Alerts and CPF Monitoring
Programmable defect criteria allow real-time detection of process deviations and quality issues, ensuring continuous monitoring and rapid response before defects propagate through production.
Gold Finger Inspection
The system detects contamination and defects on gold finger contacts before the reflow process, preventing downstream failures and improving final product quality.
Secure Defect Control
Inspection parameters can be protected against unauthorized modification, ensuring consistent inspection standards, reliable quality control, and full traceability across critical PCB manufacturing processes.