Magic Ray AXI for 3D AOI

The Magic Ray Inline 3D AXI (AXI-VX2000) system is a high-performance inline solution for 3D AOI and high-speed 3D X-ray inspection, designed for the non-destructive analysis of IGBT semiconductors, DIP and SMT components.

The system is designed to detect internal defects such as voids, solder bridges, insufficient solder, and issues in BGA/LGA/CSP, SOP/QFP/QFN packages, power modules and other electronic devices.

Key advantages:

• High-speed dynamic acquisition: inspection speed up to 1.7 seconds per FOV (Field of View), enabling high-throughput inline integration.
• Multi-angle 3D reconstruction: multi-projection and reconstruction technology that clearly reveals the internal structures of components.
• Projection and resolution flexibility: supports 7 projection modes and 7 adaptive resolution types for different inspection scenarios.
• 3-view interface (XY / YZ / XZ): more intuitive defect diagnosis thanks to simultaneous visualization on three planes.
• High-precision mechanical movement: dual linear motors with grating scales for high-precision positioning.
• Intelligent programming: supports 3 programming modes and a “one-touch” learning function to speed up setup.
• Radiation safety: radiation leakage below 0.5 µSv/h, exceeding international standards for operator protection during X-ray inspection.

Typical applications:

• Inline inspection of PCBs and SMT components (BGA/LGA/CSP, etc.).
• Quality control in the production of power modules and IGBTs.
• Inspection of hidden solder joints, detection of voids and porosity.